JPH0137430B2 - - Google Patents
Info
- Publication number
- JPH0137430B2 JPH0137430B2 JP62255425A JP25542587A JPH0137430B2 JP H0137430 B2 JPH0137430 B2 JP H0137430B2 JP 62255425 A JP62255425 A JP 62255425A JP 25542587 A JP25542587 A JP 25542587A JP H0137430 B2 JPH0137430 B2 JP H0137430B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- alloy powder
- paint
- powder
- conductive paint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000843 powder Substances 0.000 claims description 36
- 239000003973 paint Substances 0.000 claims description 30
- 229910045601 alloy Inorganic materials 0.000 claims description 21
- 239000000956 alloy Substances 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 3
- 238000013508 migration Methods 0.000 description 9
- 230000005012 migration Effects 0.000 description 9
- 238000005260 corrosion Methods 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 7
- 229910000881 Cu alloy Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000005011 phenolic resin Substances 0.000 description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229920001568 phenolic resin Polymers 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910018594 Si-Cu Inorganic materials 0.000 description 3
- 229910008465 Si—Cu Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- 229910017758 Cu-Si Inorganic materials 0.000 description 1
- 229910017931 Cu—Si Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- -1 that is Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Powder Metallurgy (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62255425A JPS63125583A (ja) | 1987-10-09 | 1987-10-09 | 導電性ペイント |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62255425A JPS63125583A (ja) | 1987-10-09 | 1987-10-09 | 導電性ペイント |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20393081A Division JPS58104969A (ja) | 1981-12-17 | 1981-12-17 | 導電性ペイント |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63125583A JPS63125583A (ja) | 1988-05-28 |
| JPH0137430B2 true JPH0137430B2 (en]) | 1989-08-07 |
Family
ID=17278585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62255425A Granted JPS63125583A (ja) | 1987-10-09 | 1987-10-09 | 導電性ペイント |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63125583A (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017115462A1 (ja) * | 2015-12-28 | 2017-07-06 | Ｄｏｗａエレクトロニクス株式会社 | 銀合金粉末およびその製造方法 |
| JP6804286B2 (ja) * | 2015-12-28 | 2020-12-23 | Ｄｏｗａエレクトロニクス株式会社 | 銀合金粉末およびその製造方法 |
-
1987
- 1987-10-09 JP JP62255425A patent/JPS63125583A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63125583A (ja) | 1988-05-28 |
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